This is all of the bits that aren’t the operating system.

Which is all foundry investment. None of the technology needed belongs to Taiwan. Intel is ramping up for Intel 3 and are already doing high volume production on the Intel 4 using EUV.

Foundries are extremely expensive and everyone was happy to let Taiwan do the whole thing. Now with the geopolitical risk, investment is ramping up into chip foundries again. Once that is done the manufacturing will be mostly on par. Which is completely different to your first post about wizards and no one else can do it nonsense.

We are however going around in circles so I’ll likely leave it here.

You haven’t named a single technology.

What Taiwanese technology? Name some.

Intel is building fabs, TSMC is moving away from Taiwan due to the geopolitical risks.

Which brings us right back to my point. They aren’t wizards, they are simply benefiting from the enormous government investment into the extremely expensive chip manufacturing industry.

Their manufacturing efficiency is top tier, their government built facilities are top tier. However they weren’t first, they aren’t the only ones who can produce them and now that the US is interested in chip manufacturing again the new facilities will match TSMC in a few years.

nanometer is a marketing term now and doesn’t reflect actual sizes. Samsung were first with “3nm”.

America was doing “3nm” in 2018. You don’t seem to have any understanding of this issue.

From Wikipedia:

The term “3 nanometer” has no direct relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors. According to the projections contained in the 2021 update of the International Roadmap for Devices and Systems published by IEEE Standards Association Industry Connection, a 3 nm node is expected to have a contacted gate pitch of 48 nanometers and a tightest metal pitch of 24 nanometers.

Also from Wikipedia:

South Korean chipmaker Samsung started shipping its 3 nm gate all around (GAA) process, named 3GAA, in mid-2022. On 29 December 2022, Taiwanese chip manufacturer TSMC announced that volume production using its 3 nm semiconductor node termed N3 is under way with good yields.

In early 2018, IMEC (Interuniversity Microelectronics Centre) and Cadence stated they had taped out 3 nm test chips, using extreme ultraviolet lithography (EUV) and 193 nm immersion lithography.

The machines are Dutch and the designs are made by the customer. The Taiwanese advantage is their government subsidised chip manufacturing. They aren’t wizards.

Strongly disagree, some exchanges don’t even have fiat on-ramps.

Blockchain is inefficient and pointless when users centralise on coinbase and binance.

Why bother with the overhead of blockchain when users centralise on a handful of banks exchanges.

Everyone is different. I think the freedom to do that is better than being arbitrarily locked out. If you are winning tournaments, why wouldn’t you hold your own against the portal enemies? Makes sense to me.

I think this is the best solution. rclone also has built in crypt too.

Edit: built in crypt if you configure it for use

Concrete? Wood and a tiny bit of metal is fine in the earth.

I notice it’s never compared to a traditional burial which is better for the environment.